Realme has released a new teaser of the Realme 3 smartphone, revealing a dual rear camera setup and a back fingerprint scanner. The phone is, individually, additionally reported to emerge in two variants powered by two different processors depending upon the area. The Realme 3 is said to be powered with the MediaTek Helio P70 processor in India, and the global variant will be powered with the MediaTek Helio P60 SoC. Realme hasn’t confirmed the launch date of the Realme 3, but it had been earlier reported that the phone will reach the market in Q1 2019.
Realme Mobiles Twitter account has tweeted still another picture of the upcoming Realme 3 showing the trunk part of the telephone. The telephone is regarded to sport a double rear camera setup aligned vertically and a rear fingerprint sensor too. The device is seen to match with a diamond cut back as well, suggesting that the case will be launched next.
Realme 3 variants (expected)
Android Authority individually reports Realme 3 will arrive in two processor variants. The publication received screenshots of two upcoming Realme apparatus with version number RMX1821 and RMX1825, and the devices had different MediaTek chipsets. Realme confirmed to the book the two devices were actually the Realme 3, and not the rumoured Realme A1. According to the report, the RMX1821 is the global variant with a MediaTek Helio P60 chip, and also the RMX1825 model together with the Helio P70 chip will be established in India-only. The screenshots also imply that the phones will sport 16:9 aspect ratio, and come with Bluetooth 4.2 support.
Realme 3 is Thought to come with a bundled cover with diamond cut pattern
Realme CEO Madhav Sheth reportedly revealed last month the Realme 3 is going to probably be launched in Q1 2019. Now that the teasers have begun to come in, expect the phone to be launched soon. There’s also sound about an upcoming smartphone which will come equipped with a 48-megapixel camera, however, there’s absolutely no word whether it will be the Realme 3 or any other device.